The Difference Between 2 Types of PCB Laser Via Forming

In PCB factories, infrared laser and ultraviolet laser via forming technologies have their own characteristics. The following are the differences between these two PCB laser via forming technologies in PCB manufacturing:

Infrared laser:

1. When the heating temperature reaches the melting point of the material, the material will melt. If the laser energy is large enough, the material will be vaporized to form vias.

2. Infrared laser can melt and vaporize resin and glass cloth to form vias, but it cannot form vias in copper foil. So, if a substrate with copper foil on the surface is drilled using infrared laser, the copper foil at the location to be laser drilled needs to be removed in advance to form a drilling point. These laser drilling points are usually produced by photoinduced pattern transfer etching technology.

Ultraviolet Laser:

1. The principle of UV laser is to use the chemical energy emitted to destroy the molecular bonds of the material being processed, causing the material to become fluffy, forming suspended particles that are sucked away, thereby creating vias.

2. The thermal effect of ultraviolet laser is very small, but the energy is greater than that of infrared laser. In addition to processing resin and glass cloth materials, it can also penetrate copper foil to form vias. So, when processing blind vias in laminated multilayer boards, it is not necessary to first remove the copper foil at the location to be laser drilled. We can directly drill the copper foil, resin and glass cloth materials.

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