The Difference between Red Glue and Solder Paste used in SMT

What is Red Glue?

Red glue is a kind of polydilute compound, it will solidify after heating, the freezing point temperature is 150 ℃, and the paste will become solid directly.

What is Solder Paste?

Solder paste is a new type of soldering material that came into being with SMT. It is a paste-like mixture formed by mixing solder powder, flux and other surfactants, thixotropic agents, etc.

The Difference between Solder Paste and Red Glue:

1. Red glue is red paste, and solder paste is gray paste.

2. The main function of the red glue is to fix the components on the PCB, so as to prevent the components from falling off during wave soldering. Red glue does not conduct electricity, it only plays a role in fixing. Solder paste is to solder the components on the PCB pads, and can complete the mechanical and electrical connection between the components and the PCB through the current.

3. The red glue is applied on the PCB solder mask between the two pads. The solder paste is dotted on the pads.

4. After the red glue is cured at high temperature, it cannot be melted by reheating. After the solder paste is cooled and solidified at high temperature, it can be melted by reheating.

5. During wave soldering, the temperature of red glue is lower than that of solder paste.

6. The red glue adopts a dispensing technology, which is suitable for PCB with few points. The solder paste adopts a furnace printing process, which can print a large number of PCB at one time.

In summary, the choice of red glue or solder paste mainly depends on the use of PCB product design materials. Generally, solder paste is used when traditional components are not used on PCB products. However, in the single sided PCB with traditional components, red glue is generally used. In some use occasions, solder paste and red glue can also be mixed.

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