Reflow soldering is a soldering technology developed with the emergence of miniaturized electronic products. It is mainly used in the soldering of various surface mount components, and has become the mainstream of PCB assembly technology in PCBA factory. So what advantages does it have?
1. When PCB manufacturers perform reflow soldering, the components are not directly immersed in the molten solder, so the thermal shock to the components is small.
2. PCB factory can control the amount of solder applied in the leading process to reduce soldering defects such as virtual soldering and bridging. Therefore, the welding quality is good, the consistency of the solder joints is good, and the reliability is high.
3. If the position of the solder on the PCB is correct in the pre-process, but the position of the component is deviated to a certain extent, and in the process of reflow soldering, when all the solder terminals, pins and corresponding pads of the components are infiltrated at the same time, due to the self-positioning effect produced by the surface tension of the molten solder, it can automatically correct the deviation and pull the component back to an approximately accurate position.
4. The solder for reflow soldering is a commercial solder paste, which can ensure the correct composition and generally does not mix impurities.
5. The reflow soldering process can use a locally heated heat source, so different soldering methods can be used on the same substrate for soldering.
6. Reflow soldering process is simple, and the workload of repairing is very small.
In addition, if the PCB adopts reflow soldering technology, solder needs to be applied to the parts to be soldered before soldering. The main methods of applying solder to solder joints are the solder paste method, the pre-coated solder method, and the pre-formed solder method.
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