What is the Difference Between Stencil and Red Glue in SMT Patching Processing

In SMT patch processing, stencil and red glue are two commonly used items. Stencil is used for solder paste on printed circuit boards, while red glue is used for glue on printed circuit boards. Do you know the difference between these two item?

1. Stencil needs better support to ensure printing quality, so it is harder than red glue. The red glue needs to have better contact with the circuit board to ensure that the glue can be evenly coated, so the red glue is softer than the stencil.

2. Stencil is usually made of stainless steel because stainless steel not only has good strength and corrosion resistance, but also has a smooth surface and will not affect the printing quality. Red glue is usually made of polyester film because polyester film is soft and has good transparency and low temperature resistance. This material can ensure that the red glue is evenly coated and help processors better understand their operation process.

3. The stencil needs to be placed directly on the circuit board, so the stencil has a smaller hole size, usually between 20 and 30 microns. Red glue needs to form a protective layer on the circuit board, so the hole size is larger, usually 70 to 120 microns. The larger hole size ensures that the glue is evenly coated and creates a strong protective layer.

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO., LTD. is a company specializing in providing overall PCBA electronic manufacturing services, including one-stop services from upstream electronic component procurement to PCB production and processing, SMT patching, DIP plug-in, PCBA testing, finished product assembly.