What is the Difference between ENEPIG and Plating Gold

ENEPIG and plating gold are relatively special surface treatment technologies in PCB. They all have the characteristics of good welding performance, good reliability and long shelf life, so do you know the difference between the two?

ENEPIG is to deposit a layer of nickel, palladium and gold on the surface of PCB by chemical method.

Plating Gold is to attach gold particles to the PCB board by electroplating. Because of its strong adhesion, it is also called hard gold. This technology can improve the hardness and wear resistance of PCB, and can effectively prevent the diffusion of copper and other metals.

The Difference between ENEPIG and Plating Gold

1. ENEPIG technology does not require lead design, and the design limitations are small. Plating gold technology must have a lead design, which has certain limitations, because the reaction can only occur after power-on.

2. ENEPIG technology can be plated with nickel-palladium-gold on the metal layer without conducting electricity; plating gold technology must be energized through the lead to make the product conductive, so that nickel-gold can be plated on the metal layer.

3. The ENEPIG process is relatively complicated, and the consumption of the potion is fast and difficult to manage. The plating gold process is simple and easy to control.

4. The ENEPIG technology has high operating temperature and the long time. The plating gold technology operation temperature is low and the time is short.

5. ENEPIG coating has good thickness uniformity; The thickness uniformity of plating gold coating is poor, and the requirements for equipment are high.

6. ENEPIG technology can design smaller PIN spacing and increase wiring density, such as higher pixel camera module products; Plating gold technology has the characteristics of high ductility, corrosion resistance and wear resistance, and is often used for pluggable fingers.

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