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What is the Difference between PCBA and SMT

2023/05/26 18:04:52

Perhaps, those who do not have a deep understanding of the PCB industry do not know the difference between PCBA and SMT. So, this article will takes you through the differences between them.

 

 

 

PCBA and SMT belong to the inclusion relationship. Among them, PCBA refers to the entire process technology from PCB to SMT assembly or DIP, and SMT is only an assembly process technology in the PCBA processing process. Therefore, it can be said that PCBA includes SMT, and then let us take a closer look.

 

 

1. SMT

SMT, or Surface Mount Technology, is a mounting technology of electronic components. Compared with traditional contact pin and socket connection method, SMT can directly install components on the surface of PCB, and connect the components to the PCB through welding and other processes. First, put the components on the corresponding positions of the PCB, and then the pins of components are connected to the pads or solder balls of the PCB by a welding machine or manual welding. In addition, SMT technology can realize high-density component mounting, making the circuit board smaller in size, higher in reliability, and higher in manufacturing efficiency.

 

 

2. PCBA

PCBA, or Printed Circuit Board Assembly, is a combination of SMT technology and other assembly technologies to mount electronic components on the PCB, and perform a series of processes such as welding and testing, and finally form a complete electronic product. First, SMT technology is used to mount the patch components on the PCB, and then DIP technology is used to mount the pin or socket-connected components on the PCB. Then, through welding, testing and other technological processes, a complete electronic product is finally formed.

 

 

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO., LTD. is a company specializing in the overall manufacturing of PCBA electronics. Including one-stop services from upstream electronic component procurement to PCB production and processing, SMT placement, DIP, PCBA testing, and finished product assembly.

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