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Layer : 4L ; Base Material : FR4 ; Board Thickness : 1.6mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 71.0*71.8 ; Panel Size(mm) : 213.0*215.4 ; Min W/S(mil) : 11.8/6.9 ; Min Hole Size : 0.3mm ; Solder Mask : White ;
https://www.hoyogo.com/Products/HYG528R04370A.htmlLayer : 4L ; Base Material : FR4 ; Board Thickness : 1.5mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 44.6*44.6 ; Panel Size(mm) : 103.2*103.2 ; Min Hole Copper Thickness : 20um ; Min W/S(mil) : 7.87/3.9 ;
https://www.hoyogo.com/Products/HYG293R04269A.htmlLayer : 4L ; Base Material : FR4 ; Board Thickness : 1.6mm ; Final Copper Thickness : 1OZ ; Surface Finished : Peelable Mask+HASL Lead Free ; Unit Size(mm) : 137.16*192.02 ; Panel Size(mm) : 274.32*210.02 ; Min W/S(mil) : 8/6 ;
https://www.hoyogo.com/Products/HYG898R04004D.htmlLayer : 4L ; Base Material : FR4 TG170 S1000-2M ; Board Thickness : 1.6mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 251.84*128.65 ; Panel Size(mm) : 251.84*138.65 ; Min Hole Size : 0.2mm ; Solder Mask : Yellow ;
https://www.hoyogo.com/Products/HYG804R04013A.htmlLayer: 14L Base Material: FR4 TG170 Board Thickness: 2.0mm Final Copper Thickness: 1OZ Surface Finished: ENIG+Impedance Control Unit Size(mm): 285.0*100.0 Panel Size(mm): 305.0*120.0 Min W/S(mil): 3/3 Min Hole Size: 0.2mm
https://www.hoyogo.com/14L-PCB.html
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