BGA PCB Production

HYG718R02021A

Layer: 2L ; Base Material: FR4 ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: OSP ; Unit Size(mm): 170.0*210.0 ; Panel Size(mm): 170.0*210.0 ; Min W/S(mil): 3.94/4 ; Min Hole Size: 0.3mm ; Special Request: BGA ;