BGA PCB manufacturer

HYG804R04003A

Layer: 4L ; Base Material: FR4 TG170 ; Board Thickness: 1.575mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 103.80*18.96 ; Panel Size(mm): 163.89*230.43 ; Min W/S(mil): 6/5 ; Min Hole Size: 0.203mm ; Special Request: BGA ;