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Layer : 8L ; Base Material : FR4 ; Board Thickness : 1.6mm ; Surface Finished : ENIG+ Gold Finger 30u" ; Solder Mask : Blue ;
https://www.hoyogo.com/Products/GoldFinger30u.htmlLayer : 4L ; Base Material : FR4 ; Board Thickness : 1.6mm ; Surface Finished : ENIG ; Min Hole Size : 0.2mm ; Solder Mask : Light Blue ;
https://www.hoyogo.com/Products/LightBlueSolderMaskP.htmlLayer: 2L ; Base Material: FR4 TG130 ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: OSP ; Unit Size(mm): 145.5*105.0 ; Panel Size(mm): 155.5*121.0 ; Min W/S(mil): 5/5 ; Min Hole Size: 0.25mm ; Solder Mask: Blue ;
https://www.hoyogo.com/Products/HYG718R02015A.htmlLayer : 4L ; Base Material : FR4 TG150 ; Board Thickness : 1.575mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 127.00*218.00 ; Panel Size(mm) : 274.32*238.76 ; Min W/S(mil) : 5/10 ; Solder Mask : Blue ;
https://www.hoyogo.com/Products/HYG904R04004A.htmlLayer: 6L ; Base Material: FR4 ; Board Thickness: 1.65mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG+Immersion Silver ; Panel Size(mm): 210.82*154.94 ; Min W/S(mil): 5/5 ; Min Hole Size: 0.23mm ; Solder Mask: Blue ;
https://www.hoyogo.com/Products/HYG882R06019A.html
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