CEM-1 Substrate

HYG528R01337A

Layer: 1L ; Base Material: CEM-1 CT1＞600 ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: OSP ; Unit Size(mm): 55.0*280.0 ; Panel Size(mm): 240.0*280.0 ; Solder Mask: White ;