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Layer: 4L ; Base Material: FR4 ; Board Thickness: 0.81mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG+Edge Plating ; Unit Size(mm): 10.79*22.86 ; Panel Size(mm): 167.64*181.61 ; Min W/S(mil): 7/10 ; Min Hole Size: 0.3mm ;
https://www.hoyogo.com/Products/HYG900R04010B.htmlLayer : 2L ; Base Material : FR4 TG130 ; Board Thickness : 1.0mm ; Surface Finished : HASL Lead Free+Edge Plating ; Unit Size(mm) : 22.5*24.5 ; Panel Size(mm) : 160.0*245.0 ; Solder Mask : Black ;
https://www.hoyogo.com/Products/HYG528R02198B.htmlLayer : 4L ; Base Material : FR4 ; Stack-Up : 1 Step(1+2+1) ; Board Thickness : 1.6mm ; Surface Finished : ENIG+ Edge Plating ; Min Hole Size : 0.15mm ;
https://www.hoyogo.com/Products/PCBEdgePlating.html
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