Layer : 2L ; Base Material : FR4 ; Board Thickness : 1.6mm ; Surface Finished : HASL Lead Free ; Unit Size(mm) : 107.0*207.0 ; Panel Size(mm) : 217.0*214.0 ; Min Hole Size : 0.4mm ; Solder Mask : Red ;
https://www.hoyogo.com/Products/HYG898R02185B.htmlLayer : 4L ; Base Material : FR4 ; Board Thickness : 1.5mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 44.6*44.6 ; Panel Size(mm) : 103.2*103.2 ; Min Hole Copper Thickness : 20um ; Min W/S(mil) : 7.87/3.9 ;
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