Layer : 2L ; Base Material : PI 50um ; Board Thickness : 0.12±0.03mm ; Final Copper Thickness: Min 15um ; Surface Finished: ENIG ; Unit Size(mm) : 2.45*5.82 ; Panel Size(mm) : 58.0*246.2 ; Min Hole Copper Thickness : 12um ; Min W/S(mil) : 3.94/3.94 ; Solder Mask Color : green ; Coverlay: yellow ;