Immersion Silver PCB

HYG882R06019A

Layer: 6L ; Base Material: FR4 ; Board Thickness: 1.65mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG+Immersion Silver ; Panel Size(mm): 210.82*154.94 ; Min W/S(mil): 5/5 ; Min Hole Size: 0.23mm ; Solder Mask: Blue ;