Immersion Tin Plating

HYG088R04039B

Layer: 4L ; Base Material: FR4 TUC TU768 ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: Immersion Tin ; Unit Size(mm): 30.0*24.0 ; Panel Size(mm): 158.0*118.0 ; Min Hole Size: 0.3mm ; Solder Mask: PSR-4000 SN10 ; Solder Mask Thickness: 10-30um ;