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Layer : 2L ; Base Material : Alu 2W/MK ; Board Thickness : 1.6mm ; Surface Finished : ENIG ; Special Process : High Precision Engraving ; Illustration : Industry Control ;
https://www.hoyogo.com/Products/HighPrecisionEngravingPCB.htmlLayer : 6L ; Base Material+Stack-up : FR4+PI ; Board Thickness : 1.6mm+0.4mm ; Surface Finished : ENIG+Gold Finger ; Min Hole Size : 0.25mm ; Illustration : Industry Control ;
https://www.hoyogo.com/Products/RigidFlexPCB.html
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