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PCB Assembly

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HYG905R04001A
Layer : 4L ; Base Material : FR4 TG170 ; Board Thickness : 1.57mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 335.28*128.83 ; Panel Size(mm) : 335.28*128.83 ; Min Hole Copper Thickness : 20um ; Min W/S(mil) : 8/8.6 ;
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PCB Assembly
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