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PCB BGA

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HYG021R04022A | BGA
Layer: 4L ; Base Material: FR4 TG130 ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 50.0*71.5 ; Panel Size(mm): 74.5*219.0 ; Min W/S(mil): 8/8 ; Min Hole Size: 0.2mm ; Special Request: BGA ;
https://www.hoyogo.com/Products/HYG021R04022A-BGA.html
HYG089R04161A
Layer: 4L ; Base Material: FR4 ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 89.3*40.0 ; Panel Size(mm): 271.9*142.0 ; Min W/S(mil): 4.7/5 ; Min Hole Size: 0.2mm ; Special Request: BGA ;
https://www.hoyogo.com/Products/HYG089R04161A.html

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