Layer : 4L ; Base Material : FR4 ; Board Thickness : 1.7mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 105.0*109.5 ; Min Hole Copper Thickness : 20um ; Min Hole Size : 0.2mm ; Min W/S(mil) : 6.3/6.3 ;
https://www.hoyogo.com/Products/HYG718R04008A.htmlLayer : 8L ; Base Material : FR4 TG150 ; Board Thickness : 1.7mm ; Final Copper Thickness : 70UM ; Surface Finished : ENIG ; Unit Size(mm) : 212.0*115.0 ; Panel Size(mm) : 212.0*145.0 ; Min W/S(mil) : 7.8/7.8 ; Min Hole Size : 0.3mm ; Peelable Mask+High Temperature Adhesive ;
https://www.hoyogo.com/Products/HYG026R08023B.htmlLayer: 4L ; Base Material: FR4 ; Board Thickness: 1.5mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 192.0*135.0 ; Min W/S(mil): 8/8 ; Min Hole Size: 0.3mm ;
https://www.hoyogo.com/Products/HYG892R04122A.html