Layer: 6L Base Material: FR4 TG170 Board Thickness: 1.6mm Final Copper Thickness: 1OZ Surface Finished: ENIG+Gold Finger+Impedance Control Unit Size(mm): 46.5*52.7 Panel Size(mm): 108.4*76.0 Min W/S(mil): 5/5.9 Min Hole Size: 0.2mm Solder Mask: Purple