Layer: 6L ; Base Material: FR4(TG170)+PI ; Board Thickness: 1.08mm ; Final Copper Thickness: 1oz ; Surface Finished: ENIG ; Unit Size(mm):140.0*50.0 ; Panel Size(mm):140.0*200.0 ; Min Hole Size : 0.12mm ; Min Hole Copper Thickness : 20um ; Min W/S(mil): 3.94/3.94 ; Solder Mask: green ; Coverlay: ye...