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Layer : 4L ; Base Material : FR-4 TG130 ; Board Thickness : 3.2±0.3mm ; Final Copper Thickness: 1OZ ; Surface Finished : HASL Lead Free ; Min Hole Copper Thickness : 0.6mm ; Min W/S(mil) : 15.75/12 ; Solder Mask Color : Green Matt ;
https://www.hoyogo.com/Products/ThickPCBHYG892R04134.htmlLayer: 1L ; Base Material: FR4(NAN YA) ; Board Thickness: 3.20mm ; Final Copper Thickness: 1oz ; Surface Finished : HASL Lead Free ; Unit Size（mm）：394.00*574.00 ; Panel Size（mm）：394.00*574.00 ; Min Hole Size : 1.0mm ;
https://www.hoyogo.com/Products/SinglesidedHYG898RF0.htmlThick PCB Layer: 8L Base Material: KB-6165F Board Thickness: 3.54mm Outer Copper Thickness: Min. 52.9um Inner Copper Thickness: 189um Surface Finished: ENIG Unit Size(mm): 454.0*257.0 Solder Mask: Green Matt Special Request: Line angle minimum 5.08um, line area maximum 50.8um
https://www.hoyogo.com/Thick-PCB.html
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