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Layer : 2L Base Material : PI 50um Board Thickness : 0.12±0.03mm Final Copper Thickness: Min 15um Surface Finished: ENIG Unit Size(mm) : 2.0*18.7 Panel Size(mm) : 35.0*58.0 Min Hole Copper Thickness : 12um Min W/S(mil) : 3.94/3.94 Solder Mask Color : green Coverlay: yellow
https://www.hoyogo.com/Products/Thin PCBHYG306F02018A.htmlLayer : 2L ; Base Material : PI 50um ; Board Thickness : 0.12±0.03mm ; Final Copper Thickness: Min 15um ; Surface Finished: ENIG ; Unit Size(mm) : 2.45*5.82 ; Panel Size(mm) : 58.0*246.2 ; Min Hole Copper Thickness : 12um ; Min W/S(mil) : 3.94/3.94 ; Solder Mask Color : green ; Coverlay: yellow ;
https://www.hoyogo.com/Products/LongThinPCBHYG306F02.htmlLayer: 2L Base Material: PI Board Thickness: 0.1mm Final Copper Thickness: 18UM Surface Finished: ENIG Unit Size(mm): 92.7*40.5 Min W/S(mil): 4/4 Solder Mask: Yellow
https://www.hoyogo.com/Thin-FPC.htmlThin PCB Special Request: Solder Mask Ink Model: PM-500 WD-87SF, Solder Mask Thickness on Copper Edge: Min. 10um. Layer: 2L Base Material: FR4 TG170 Board Thickness: 0.3mm Final Copper Thickness: 18um Surface Finished: ENIG Unit Size(mm): 239.50*21.00 Min W/S(mil): 10/11.6 Min Hole Size: 0.2m...
https://www.hoyogo.com/Thin-PCB.htmlThin PCB Special Request: 1. Customer specified (SY) Q100C; 2. Bow&Twist≤0.75%. Layer: 1L Base Material: FR4 Board Thickness: 0.3±0.05mm Final Copper Thickness: 1OZ Surface Finished: ENIG Unit Size(mm): 130.20*547.20 Min. W/S(mil): 27.56/31.49
https://www.hoyogo.com/Thin-PCB-HYG089R01358B.html
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