What is BGA

HYG021R04022A | BGA

Layer: 4L ; Base Material: FR4 TG130 ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 50.0*71.5 ; Panel Size(mm): 74.5*219.0 ; Min W/S(mil): 8/8 ; Min Hole Size: 0.2mm ; Special Request: BGA ;