Layer : 2L Base Material : PI 50um Board Thickness : 0.12±0.03mm Final Copper Thickness: Min 15um Surface Finished: ENIG Unit Size(mm) : 2.0*18.7 Panel Size(mm) : 35.0*58.0 Min Hole Copper Thickness : 12um Min W/S(mil) : 3.94/3.94 Solder Mask Color : green Coverlay: yellow