Layer : 10L
Base Material : FR4 TG150
Stack-Up : 2 Step(2+6+2)
Board Thickness : 0.8mm
Surface Finished : ENIG+OSP
Min Hole Size : 0.1mm
Application : Intelligent Mobile Phone
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.