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HDI PCB manufacturer

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10L HDI PCB
Layer : 10L ; Base Material : FR4 TG150 ; Stack-Up : 2 Step(2+6+2) ; Board Thickness : 0.8mm ; Surface Finished : ENIG+OSP ; Min Hole Size : 0.1mm ; Application : Intelligent Mobile Phone ;
https://www.hoyogo.com/Products/10LHDIPCB.html
Intelligent Mobile Phone Application PCB
Layer : 4L ; Base Material : FR4 TG150 ; Stack-Up : 1 Step(1+2+1) ; Board Thickness : 0.8mm ; Surface Finished : ENIG+OSP ; Min Hole Size : 0.1mm ; Application : Intelligent Mobile Phone ;
https://www.hoyogo.com/Products/HDIPCB2.html

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