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BGA|HYG718R02004B

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BGA|HYG718R02004B
BGA|HYG718R02004B
BGA|HYG718R02004B
Product Details

Layer : 2L

Base Material : FR4

Board Thickness : 1.6mm

Final Copper Thickness : 1OZ

Surface Finishing: OSP

Unit Size(mm) : 210.0*145.0

Panel Size(mm) : 210.0*157.0

Min Hole Copper Thickness : 20um

Min W/S(mil) : 3.94/3.94

special request : BGA

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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