Layer : 2L
Base Material : FR4
Board Thickness : 1.6mm
Final Copper Thickness : 1OZ
Surface Finishing: OSP
Unit Size(mm) : 210.0*145.0
Panel Size(mm) : 210.0*157.0
Min Hole Copper Thickness : 20um
Min W/S(mil) : 3.94/3.94
special request : BGA
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.