OSP

BGA|HYG718R02004B

Layer : 2L ; Base Material : FR4 ; Board Thickness : 1.6mm ; Final Copper Thickness : 1OZ ; Surface Finishing: OSP ; Unit Size(mm) : 210.0*145.0 ; Panel Size(mm) : 210.0*157.0 ; Min Hole Copper Thickness : 20um ; Min W/S(mil) : 3.94/3.94 ; special request : BGA ;

Hospital bed control board

HYG892A01013A | T112

Layer: 1L ; Base Material: T112 ; Board Thickness: 1.5mm ; Final Copper Thickness: 2OZ ; Surface Finished: OSP ; Unit Size(mm): 14.0*309.0 ; Panel Size(mm): 132.0*309.0 ; Solder Mask: Taiyo PSR 4000 ET-WT 02 (Halogen free) ;

HYG718R02015A

Layer: 2L ; Base Material: FR4 TG130 ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: OSP ; Unit Size(mm): 145.5*105.0 ; Panel Size(mm): 155.5*121.0 ; Min W/S(mil): 5/5 ; Min Hole Size: 0.25mm ; Solder Mask: Blue ;

HYG1233R01015A

Long PCB ; Layer: 1L ; Base Material: FR4 TG＞130 ; Board Thickness: 1.0mm ; Final Copper Thickness: 1OZ ; Surface Finished: OSP ; Unit Size(mm): 1159.0*20 ; Panel Size(mm): 1159.0*320.0 ; Solder Mask: White ;

HYG1226F02011A

Layer : 2L ; Base Material : PI 25UM ; Board Thickness : 0.21mm ; Final Copper Thickness : 1OZ ; Surface Finished : OSP ; Unit Size(mm) : 60.08*24.89 ; Panel Size(mm) : 60.08*24.89 ; Min W/S(mil) : 10/10 ; Solder Mask : Yellow ;

HYG1060A01002A

Silkscreen: Red ; Layer: 1L ; Base Material: ALU 1W/MK ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: OSP ; Unit Size(mm): 14.8*1180.0 ; Panel Size(mm): 118.4*1180.0 ; V-Cut Remaining Thickness: 0.3±0.1mm ; Solder Mask: White ;

1500mm FR4 Single-sided OSP