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HYG1226F02011A

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HYG1226F02011A
HYG1226F02011A
Product Details

Layer : 2L

Base Material : PI 25UM

Board Thickness : 0.21mm

Final Copper Thickness : 1OZ

Surface Finished : OSP

Unit Size(mm) : 60.08*24.89

Panel Size(mm) : 60.08*24.89

Min W/S(mil) : 10/10

Solder Mask : Yellow

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UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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