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Layer: 1L ; Base Material: Copper Foil ; Board Thickness: 0.25mm ; Final Copper Thickness: 1OZ ; Surface Finished: Electric Tin ; Unit Size(mm): 73.44*26.30 ; Panel Size(mm): 73.44*26.30 ; Solder Mask: Yellow Coverlay ; Special Request: Copper Sheet Stiffener on 3 Positions ;
https://www.hoyogo.com/Products/HYG089F01252A.htmlLayer : 1L ; Base Material : FPC+Alu 122W/MK ; Board Thickness : 0.13mm+1.5mm ; Surface Finished : OSP ; Application : LED ;
https://www.hoyogo.com/Products/FPCALU.htmlLayer : 1L ; Base Material : PI ; Board Thickness : 0.155mm ; Final Copper Thickness : 35um ; Surface Finished : ENIG ; Coverlay : Yellow ;
https://www.hoyogo.com/Products/HYG802R01005A.htmlLayer : 2L ; Base Material : PI 50UM(SF302) ; Board Thickness : 0.35mm ; Final Copper Thickness : 65 UM ; Surface Finished : ENIG+Immersion Silver ; Unit Size(mm) : 306.30*195.44 ; Min Hole Copper Thickness : 12um ; Min W/S(mil) : 8/8 ; Coverlay : Yellow ;
https://www.hoyogo.com/Products/HYG528F02378A.htmlLayer : 1L ; Base Material : Cu Base 144w/mk+FPC ; Board Thickness : 1.6mm ; Surface Finished : OSP ; Illustration : Thermoelectric Separation ;
https://www.hoyogo.com/Products/CuBaseFPC.htmlLayer : 1L ; Base Material : PI ; Board Thickness : 0.13mm ; Final Copper Thickness : 0.5OZ ; Surface Finished : ENIG+Gold Finger ; Unit Size(mm) : 367.03*15.24 ; Min W/S(mil) : 15.75/14 ; Solder Mask : Black ;
https://www.hoyogo.com/Products/HYG882F01018A.htmlLayer : 2L ; Base Material : PI ; Board Thickness : 0.23mm ; Final Copper Thickness : 1.5OZ ; Surface Finished : ENIG ; Unit Size(mm) : 9*24.54 ; Panel Size(mm) : 9*24.54 ; Solder Mask : Yellow ;
https://www.hoyogo.com/Products/HYG1226F02012A.htmlLayer : 2L ; Base Material : PI 25UM ; Board Thickness : 0.21mm ; Final Copper Thickness : 1OZ ; Surface Finished : OSP ; Unit Size(mm) : 60.08*24.89 ; Panel Size(mm) : 60.08*24.89 ; Min W/S(mil) : 10/10 ; Solder Mask : Yellow ;
https://www.hoyogo.com/Products/HYG1226F02011A.htmlLayer : 1L ; Base Material : PI ; Board Thickness : 0.13mm ; Final Copper Thickness : 1OZ ; Surface Finished : Plated Tin ; Unit Size(mm) : 36.25*57.70 ; Panel Size(mm) : 36.25*57.70 ; Solder Mask : Yellow ;
https://www.hoyogo.com/Products/HYG528F01192.htmlLayer : 2L ; Base Material : PI ; Board Thickness : 0.15mm ; Min Hole Copper Thickness : 20um ; Final Copper Thickness : 1OZ ; Surface Finishing: ENIG/Gold finger ; Unit Size(mm) : 58.0*16.46 ; Panel Size(mm) : 58.0*16.46 ; W/...
https://www.hoyogo.com/Products/HYG1103F02015BFPC.htmlLayer : 2L ; Base Material : PI 50UM ; Board Thickness : 146+/-30 ; Final Copper Thickness : 15um ; Surface Finishing: ENIG ; Unit Size(mm) : 3.18*755.0 ; Panel Size(mm) : 58.0*770.0 ; Min hole size : 0.1mm ; Min Hole Copper Thickn...
https://www.hoyogo.com/Products/longFPCHYG306F02019A.htmlLayer:4 ; Base Material:FR4+PI ; Board Thickness:1.82mm ; Unit size:300.37 x 80.16mm ; W/...
https://www.hoyogo.com/Products/4LFlexrigidboard.htmlLayer: 2L Base Material: PI Board Thickness: 0.1mm Final Copper Thickness: 18UM Surface Finished: ENIG Unit Size(mm): 92.7*40.5 Min W/S(mil): 4/4 Solder Mask: Yellow
https://www.hoyogo.com/HYG1103F02027A.htmlLayer: 2L Base Material: PI Board Thickness: 0.1mm Final Copper Thickness: 18UM Surface Finished: ENIG Unit Size(mm): 92.7*40.5 Min W/S(mil): 4/4 Solder Mask: Yellow
https://www.hoyogo.com/Thin-FPC.htmlFPC+Stiffener Thickness: 0.3±0.05mm Layer: 1L Base Material: Shengyi SF305 Board Thickness: 0.155mm Final Copper Thickness: 1OZ Surface Finished: ENIG Unit Size(mm): 3.3*82.0 Coverlay: Shengyi SF305C
https://www.hoyogo.com/HYG1281F01012A.htmlLayer: 2L Base Material: PI+FR4 Stiffener Board Thickness: 0.18mm Final Copper Thickness: 25UM Surface Finished: Immersion Tin Unit Size(mm): 57.85*36.75 Panel Size(mm): 137.0*206.0 Coverlay: Yellow
https://www.hoyogo.com/FR4-Stiffener-FPC.htmlLayer: 2L Base Material: PI Board Thickness: 0.15mm Surface Finished: ENIG+Impedance Control Unit Size(mm): 5.6*12.9 Panel Size(mm): 5.6*12.9 Min W/S(mil): 5.5/9 Min Hole Size: 0.2mm Bottom Stiffener
https://www.hoyogo.com/Impedance-Control-FPC.html
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