Layer : 1L
Base Material : PI
Board Thickness : 0.13mm
Final Copper Thickness : 0.5OZ
Surface Finished : ENIG+Gold Finger
Unit Size(mm) : 367.03*15.24
Min W/S(mil) : 15.75/14
Solder Mask : Black
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.