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HYG882F01018A

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HYG882F01018A
HYG882F01018A
HYG882F01018A
Product Details

Layer : 1L

Base Material : PI

Board Thickness : 0.13mm

Final Copper Thickness : 0.5OZ

Surface Finished : ENIG+Gold Finger

Unit Size(mm) : 367.03*15.24

Min W/S(mil) : 15.75/14

Solder Mask : Black

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UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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