HYG1103F02015B|FPC

Layer : 2L

Base Material : PI

Board Thickness : 0.15mm

Min Hole Copper Thickness : 20um

Final Copper Thickness : 1OZ

Surface Finishing: ENIG/Gold finger

Unit Size(mm) : 58.0*16.46

Panel Size(mm) : 58.0*16.46

W/S(mil) : 9.8/7.8

Solder Mask : Yellow Coverlay

Special requirements：PI reinforcement；FPC total thickness：0.3+-0.05mm (including reinforcement)；no added UL and cycle Au: 0.06；Ni：3um（min）；Finger position hard thick gold (gold thickness 0.8um), accept lead residue