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Layer : 2L ; Base Material : PI ; Board Thickness : 0.28mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Board thickness on gold finger : 0.18mm+10%/-8% ; Unit Size(mm) : 342.5*163.0 ; Panel Size(mm) : 342.5*163.0 ; Min Hole Copper Thickness : 20um ; Min W/S(mil) : 5.9/5.9 ; Coverlay : ...
https://www.hoyogo.com/Products/HYG896F02001B.htmlLayer : 2L ; Base Material : PI ; Board Thickness : 0.15mm ; Min Hole Copper Thickness : 20um ; Final Copper Thickness : 1OZ ; Surface Finishing: ENIG/Gold finger ; Unit Size(mm) : 58.0*16.46 ; Panel Size(mm) : 58.0*16.46 ; W/...
https://www.hoyogo.com/Products/HYG1103F02015BFPC.html
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