HYG896F02001B

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Product Details

Layer : 2L

Base Material : PI

Board Thickness : 0.28mm

Final Copper Thickness : 1OZ

Surface Finished : ENIG

Board thickness on gold finger : 0.18mm+10%/-8%

Unit Size(mm) : 342.5*163.0

Panel Size(mm) : 342.5*163.0

Min Hole Copper Thickness : 20um

Min W/S(mil) : 5.9/5.9

Coverlay : Yellow

ISO Certification

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.