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Layer: 1L ; Base Material: Copper Foil ; Board Thickness: 0.25mm ; Final Copper Thickness: 1OZ ; Surface Finished: Electric Tin ; Unit Size(mm): 73.44*26.30 ; Panel Size(mm): 73.44*26.30 ; Solder Mask: Yellow Coverlay ; Special Request: Copper Sheet Stiffener on 3 Positions ;
https://www.hoyogo.com/Products/HYG089F01252A.htmlLayer : 2L ; Base Material : PI ; Board Thickness : 0.28mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Board thickness on gold finger : 0.18mm+10%/-8% ; Unit Size(mm) : 342.5*163.0 ; Panel Size(mm) : 342.5*163.0 ; Min Hole Copper Thickness : 20um ; Min W/S(mil) : 5.9/5.9 ; Coverlay : ...
https://www.hoyogo.com/Products/HYG896F02001B.htmlLayer : 2L ; Base Material : PI 50UM(SF302) ; Board Thickness : 0.35mm ; Final Copper Thickness : 65 UM ; Surface Finished : ENIG+Immersion Silver ; Unit Size(mm) : 306.30*195.44 ; Min Hole Copper Thickness : 12um ; Min W/S(mil) : 8/8 ; Coverlay : Yellow ;
https://www.hoyogo.com/Products/HYG528F02378A.htmlLayer : 2L ; Base Material : PI ; Board Thickness : 0.2mm ; Final Copper Thickness : 18UM ; Surface Finished : ENIG ; Unit Size(mm) : 260.0*15.6 ; Min W/S(mil) : 3.94/4 ; Min Hole Size : 0.1mm ; Solder Mask : Yellow Coverlay ;
https://www.hoyogo.com/Products/HYG1281F02026A.htmlLayer : 2L ; Base Material : PI ; Board Thickness : 0.23mm ; Final Copper Thickness : 1.5OZ ; Surface Finished : ENIG ; Unit Size(mm) : 9*24.54 ; Panel Size(mm) : 9*24.54 ; Solder Mask : Yellow ;
https://www.hoyogo.com/Products/HYG1226F02012A.html
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