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HYG528F02378A

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HYG528F02378A
Product Details

Layer : 2L

Base Material : PI 50UM(SF302)

Board Thickness : 0.35mm

Final Copper Thickness : 65 UM

Surface Finished : ENIG+Immersion Silver

Unit Size(mm) : 306.30*195.44

Min Hole Copper Thickness : 12um

Min W/S(mil) : 8/8

Coverlay : Yellow

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UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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