Layer : 2L
Base Material : PI 50UM(SF302)
Board Thickness : 0.35mm
Final Copper Thickness : 65 UM
Surface Finished : ENIG+Immersion Silver
Unit Size(mm) : 306.30*195.44
Min Hole Copper Thickness : 12um
Min W/S(mil) : 8/8
Coverlay : Yellow
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.