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Layer : 2L ; Base Material : PI 50UM(SF302) ; Board Thickness : 0.35mm ; Final Copper Thickness : 65 UM ; Surface Finished : ENIG+Immersion Silver ; Unit Size(mm) : 306.30*195.44 ; Min Hole Copper Thickness : 12um ; Min W/S(mil) : 8/8 ; Coverlay : Yellow ;
https://www.hoyogo.com/Products/HYG528F02378A.htmlLayer : 2L ; Base Material : PI ; Board Thickness : 0.2mm ; Final Copper Thickness : 18UM ; Surface Finished : ENIG ; Unit Size(mm) : 260.0*15.6 ; Min W/S(mil) : 3.94/4 ; Min Hole Size : 0.1mm ; Solder Mask : Yellow Coverlay ;
https://www.hoyogo.com/Products/HYG1281F02026A.html
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