4L Flex rigid board 1.82mm FR4 PI

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Product Details

Layer:4	Base Material:FR4+PI
Board Thickness:1.82mm	Unit size:300.37 x 80.16mm
W/S(mil)：4u	Surface Finishing: ENIG Thickness
Solder Mask:Green	Copper OZ:1OZ

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Layer	Quick service	Standard service
Double-sided	3days	10days
4Layer	5days	12days
6Layer	6days	14days
8Layer	7days	15days
10Layer	8days	18days
10Layer above	8-10days	20days

Item	Flex pcb	Rigid-Flex pcb
Material	PI,PET,PEN	FR4+PI
Layers	1-12	2-12
Base copper thickness	1/4-2OZ	1/4-2OZ for flex,1/4-4oz for rigid
Board dimension(Max)	500mm x 800mm
Via type	Through hole, blind , buried
Silkscreen Width/Space	0.10mm
Solder mask bridge	0.20mm for coverlay ,0.12mm for LPI
Drill	0.15mm
Punching	0.5mm
Ni/Auplating	Ni:2-8um(80-320u”) Au:0.05-2um(2-80”)
ENIG	Ni:2-6um(80-240u”) Au:0.05-0.10um(2-4u”)
Tin plating	5-20um
Immersion silver	0.1-0.4um
Immersion Tin	0.5-1.5um
OSP	0.2um min
Hard gold	Hardness over 150HV

Special Techniques--Blind & Buried via, via in pad ,hard gold and gold fingers,Flash gold,Ni/Pd/Au finish,Edge plating.Depth control routing,Countersunk holes,etc

Special Services--FPC & Rigid/Flex quick turn, heavy copper mass production, IMS boards
PCBA Assembly Service--Small Volume and mass production

Characteristics of the flexible board: FPC is widely used in the occasions where dynamic structure is needed, and its bending resistance and pull resistance are its greatest characteristics!

Bend factors:

N1. Copper structure: The rolled copper has better tensile properties than ED copper. In the occasions where bending and pulling are required, it is generally necessary to use rolled copper!

N2. Minimum Tension Fatigue: In order to obtain the minimum tensile fatigue of the copper in the circuit, the press-fit structure of the FPC needs to be balanced!

N3. Bending radius: If the bending radius is large, the tension at the stress point can be reduced, and the bending life can be increased!

N4.FPC thickness: FPC thickness can reduce the stress of the copper wire