pcb manufacturer

0.15mm FR4 thin board

HYG293R01158A

Layer : 1L ; Base Material : FR4 TG≥135 ; Board Thickness : 1.0mm ; Final Copper Thickness : 1OZ ; Surface Finished : HASL Lead Free ; Unit Size(mm) : 256.0*14.1 ; Panel Size(mm) : 276.0*122.0 ;

HYG898R06270A

Layer: 6L ; Base Material: FR4 TG150 ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 155.19*86.75 ; Panel Size(mm): 172.21*284.61 ; Min W/S(mil): 6/6 ; Min Hole Size: 0.25mm ;

High density PCB

Thick PCB|HYG892R04134B

Layer : 4L ; Base Material : FR-4 TG130 ; Board Thickness : 3.2±0.3mm ; Final Copper Thickness: 1OZ ; Surface Finished : HASL Lead Free ; Min Hole Copper Thickness : 0.6mm ; Min W/S(mil) : 15.75/12 ; Solder Mask Color : Green Matt ;

Hospital bed control board

Different Shape PCB

Layer : 2L ; Base Material : FR4 ; Board Thickness : 1mm ; Final Copper Thickness : 1OZ ; Surface Finished : HASL Lead Free ; Unit Size(mm) : 102.50*71.31 ;

Medical equipment

HYG718R04008A

Layer : 4L ; Base Material : FR4 ; Board Thickness : 1.7mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 105.0*109.5 ; Min Hole Copper Thickness : 20um ; Min Hole Size : 0.2mm ; Min W/S(mil) : 6.3/6.3 ;

HYG528R02373A

Layer : 2L ; Base Material : FR4 ; Board Thickness : 1.1mm ; Min Hole Copper Thickness : 20um ; Final Copper Thickness : 1OZ ; Surface Finishing : HASL Lead Free ; Unit Size(mm) : 30.988*115.316 ; Panel Size(mm) : 184.4*253.49 ; Min W/S(mil) : 10/9.7 ;

HYG026R08023B

Layer : 8L ; Base Material : FR4 TG150 ; Board Thickness : 1.7mm ; Final Copper Thickness : 70UM ; Surface Finished : ENIG ; Unit Size(mm) : 212.0*115.0 ; Panel Size(mm) : 212.0*145.0 ; Min W/S(mil) : 7.8/7.8 ; Min Hole Size : 0.3mm ; Peelable Mask+High Temperature Adhesive ;

FR4 1400mm length Double-sided

HYG026R06034A

High Temperature Adhesive ; Layer : 6L ; Base Material : FR4 TG150 ; Board Thickness : 1.55mm ; Surface Finished : ENIG ; Unit Size(mm) : 190.0*110.0 ; Panel Size(mm) : 190.0*134.0 ; Min W/S(mil) : 7.9/7.9 ; Min Hole Size : 0.3mm ;

HYG089R02250A

Layer: 2L ; Base Material: FR4 TG130 ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: HASL Lead Free ; Unit Size(mm): 46.12*25.25 ; Panel Size(mm): 58.12*161.74 ; Min Hole Size: 0.3mm ;

HYG898R02017C

Layer : 2L ; Base Material : FR4 ; Board Thickness : 1.6mm ; Final Copper Thickness : 1OZ ; Surface Finished : Peelable mask+HASL Lead Free ; Unit Size(mm) : 224.0*185.0 ; Panel Size(mm) : 224.0*185.0 ; Min Hole Copper Thickness : 20um ; Min W/S(mil) : 9/8.9 ;

HYG088R00048A

Double-Sided Circuitless ; Layer : 0L ; Base Material : FR4 Yellow Core Board Material ; Board Thickness : 1.0mm ; Surface Finished : ENIG ; Unit Size(mm) : 177.02*77.0 ; Solder Mask : White ;

HYG902R04025A

Layer : 4L ; Base Material : FR4 TG170 ; Board Thickness : 1.575mm ; Final Copper Thickness : 2/1/1/2OZ ; Surface Finished : ENIG ; Unit Size(mm) : 95.25*234.95 ; Panel Size(mm) : 95.25*234.95 ; Min Hole Copper Thickness : 20um ; Min W/S(mil) : 9.8/9.8 ; Solder Mask Thickness : min 10um ;

HYG1009R06012A

Layer : 6L ; Base Material : FR4 TG135 ; Board Thickness : 1.6mm ; Final Copper Thickness : 1OZ ; Surface Finished : HASL Lead Free ; Unit Size(mm) : 161.0*168.0 ; Min Hole Copper Thickness : 20um ; Min W/S(mil) : 7.87/7.87 ;

6L FR4|HYG898R06098A

Layer : 6L ; Base Material : FR4 ; Board Thickness : 1.6mm ; Final Copper Thickness : 1OZ ; Surface Finished: ENIG ; Unit Size(mm) : 363.22*125.73 ; Min hole size : 0.2mm ; Min Hole Copper Thickness : 25um ; Min W/S(mil) : 4/4.9 ;

HYG293R02320A

Layer : 2L ; Base Material : FR4 TG130 ; Board Thickness : 1.6mm ; Final Copper Thickness : 1OZ ; Surface Finished : HASL Lead Free ; Unit Size(mm) : 123.75*86.0 ; Panel Size(mm) : 123.75*86.0 ; Min W/S(mil) : 11.8 ; Solder Mask : White ;

HYG882R04004B

Layer : 4L ; Base Material : FR4 ; Board Thickness : 1.57mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 266.7*69.6 ; Min W/S(mil) : 10/10 ;

HYG892R06188A

Layer: 6L ; Base Material: FR4 ; Board Thickness: 1.5mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 58.1*80.0 ; Panel Size(mm): 259.41*190.00 ; Min W/S(mil): 7.8/5.9 ; Min Hole Size: 0.2mm ; Solder Mask: Green Matt ;

HYG804R02009A

Layer : 2L ; Base Material : FR4 ITEQ IT158TC ; Board Thickness : 1.6mm ; Final Copper Thickness : 1OZ ; Surface Finished : HASL Lead ; Unit Size(mm) : 17.02*128.78 ; Panel Size(mm) : 277.88*428.75 ; Min Hole Copper Thickness : 20um ; special request : No line-supplyment ; Min. Tin thickness: 2um ;

Light Blue Solder Mask PCB

Layer : 4L ; Base Material : FR4 ; Board Thickness : 1.6mm ; Surface Finished : ENIG ; Min Hole Size : 0.2mm ; Solder Mask : Light Blue ;

HYG528R01113B

Layer : 1L ; Base Material : FR4 SY-1000-2M ; Board Thickness : 1.5mm ; Final Copper Thickness : 1OZ ; Surface Finished : HASL Lead Free ; Unit Size(mm) : 16.9*24.0 ; Min Hole Size : 5.0mm ; Solder Mask : / ; Tolerance : ±0.1mm ;

6L ENIG|HYG892R06307A

Layer : 6L ; Base Material : FR4 ; Board Thickness : 1.5mm ; Surface Finished :  ENIG ; Unit Size(mm) : 160.0*100.0 ; Panel Size(mm) : 180.0*225.0 ; Min Hole Copper Thickness : 20um ;

HYG293R04003B

Layer: 4L ; Base Material: FR4 CT1≥175 ; Board Thickness: 2.0mm ; Final Copper Thickness: 2OZ ; Surface Finished: ENIG ; Unit Size(mm): 92.99*48.01 ; Panel Size(mm): 109.0*268.0 ; Min Hole Size: 0.2mm ;

HYG898R02197A

Layer : 2L ; Base Material : FR4 ; Board Thickness : 1.6mm ; Final Copper Thickness : 1OZ ; Surface Finished : HASL Lead Free ; Unit Size(mm) : 58.0*61.0 ; Panel Size(mm) : 232.0*122.0 ;

HYG293R04328A

Layer : 4L ; Base Material : FR4 ; Board Thickness : 1.55mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 21.7*42.5 ; Panel Size(mm) : 162.0*113.0 ; Min W/S(mil) : 7.9/6.9 ; Min Hole Size : 0.15mm ;

HYG892R04122A

Layer: 4L ; Base Material: FR4 ; Board Thickness: 1.5mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 192.0*135.0 ; Min W/S(mil): 8/8 ; Min Hole Size: 0.3mm ;

HYG306R02007B

Layer : 2L ; Base Material : FR4 TG135 ; Board Thickness : 0.5mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 58.8*9.0 ; Panel Size(mm) : 80.0*128.0 ; Min W/S(mil) : 9.8/7.9 ;

AC Controller

HYG905R04001A

Layer : 4L ; Base Material : FR4 TG170 ; Board Thickness : 1.57mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 335.28*128.83 ; Panel Size(mm) : 335.28*128.83 ; Min Hole Copper Thickness : 20um ; Min W/S(mil) : 8/8.6 ;

Copper Base PCB

HYG898R02207A

Layer: 2L ; Base Material: FR4 ; Board Thickness : 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 50.0*60.0 ; Panel Size(mm): 232.0*206.0 ;

HYG528R02364B

Layer : 2L ; Base Material : FR4 TG150 ; Board Thickness : 1.0mm ; Final Copper Thickness : 1OZ ; Surface Finished : HASL Lead Free ; Unit Size(mm) : 5.5*144.0 ; Panel Size(mm) : 179.8*248.5 ; Min W/S(mil) : 19.7 ; Solder Mask : Green Matt ;

HYG898R02084A | HASL Lead Free

Layer: 2L ; Base Material: FR4 ; Board Thickness: 1.6mm ; Surface Finished: HASL Lead Free ; Unit Size(mm): 233.43*159.89 ; Panel Size(mm): 245.43*319.79 ; Min Hole Size: 0.3mm ; Solder Mask: Green Matt ;

1500mm FR4 Single-sided OSP

1450mm Alu PCB

HYG1281F02001A