HYG089R02250A

Product Image

Product Details

Layer: 2L

Base Material: FR4 TG130

Board Thickness: 1.6mm

Final Copper Thickness: 1OZ

Surface Finished: HASL Lead Free

Unit Size(mm): 46.12*25.25

Panel Size(mm): 58.12*161.74

Min Hole Size: 0.3mm

ISO Certification

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.