PCB

HYG293R01158A

Layer : 1L ; Base Material : FR4 TG≥135 ; Board Thickness : 1.0mm ; Final Copper Thickness : 1OZ ; Surface Finished : HASL Lead Free ; Unit Size(mm) : 256.0*14.1 ; Panel Size(mm) : 276.0*122.0 ;

6L PCB|HYG898R06174A

Layer : 6L ; Base Material : FR4 ; Board Thickness : 1.7mm ; Final Copper Thickness : 1OZ ; Surface Finished: ENIG ; Unit Size(mm) : 340.0*180.0 ; Panel Size(mm) : 340.0*196.0 ; Min Hole Copper Thickness : 20um ; Min W/S(mil) : 5.9/8.66 ; Solder Mask : White ( in accordance with IPC-SM-840) ;

Aluminum PCB|HYG709A01021A

Layer : 1L ; Base Material : ALU 1W/MK ; Board Thickness : 1.0mm ; Final Copper Thickness : 1OZ ; Surface Finished : HASL Lead Free ; Unit Size(mm) : 15.0*340.0 ; Panel Size(mm) : 160.0*340.0 ; Solder Mask : Black ;

High density PCB

Thick PCB|HYG892R04134B

Layer : 4L ; Base Material : FR-4 TG130 ; Board Thickness : 3.2±0.3mm ; Final Copper Thickness: 1OZ ; Surface Finished : HASL Lead Free ; Min Hole Copper Thickness : 0.6mm ; Min W/S(mil) : 15.75/12 ; Solder Mask Color : Green Matt ;

Different Shape PCB

Layer : 2L ; Base Material : FR4 ; Board Thickness : 1mm ; Final Copper Thickness : 1OZ ; Surface Finished : HASL Lead Free ; Unit Size(mm) : 102.50*71.31 ;

4mm Cu Base PCB

Layer : 1L ; Base Material : Cu Base ; Board Thickness : 4.0mm ; Surface Finished : ENIG ;

HYG807R02028A

Gold Finger PCB ; Layer : 2L ; Base Material : FR4 KB6160 TG130 ; Board Thickness : 1.6mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 87.0*65.4 ; Panel Size(mm) : 174.0*130.8 ;

HYG026R08023B

Layer : 8L ; Base Material : FR4 TG150 ; Board Thickness : 1.7mm ; Final Copper Thickness : 70UM ; Surface Finished : ENIG ; Unit Size(mm) : 212.0*115.0 ; Panel Size(mm) : 212.0*145.0 ; Min W/S(mil) : 7.8/7.8 ; Min Hole Size : 0.3mm ; Peelable Mask+High Temperature Adhesive ;

HYG305R06001A

Layer : 6L ; Base Material : FR4 ; Board Thickness : 1.6mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 95.0*112.0 ; Panel Size(mm) : 244.0*200.0 ; Min Hole Copper Thickness : 25um ; Min W/S(mil) : 5.9/5.5 ;

PCB Assembly

HYG089R02250A

Layer: 2L ; Base Material: FR4 TG130 ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: HASL Lead Free ; Unit Size(mm): 46.12*25.25 ; Panel Size(mm): 58.12*161.74 ; Min Hole Size: 0.3mm ;

HYG898R02017C

Layer : 2L ; Base Material : FR4 ; Board Thickness : 1.6mm ; Final Copper Thickness : 1OZ ; Surface Finished : Peelable mask+HASL Lead Free ; Unit Size(mm) : 224.0*185.0 ; Panel Size(mm) : 224.0*185.0 ; Min Hole Copper Thickness : 20um ; Min W/S(mil) : 9/8.9 ;

HYG088R00048A

Double-Sided Circuitless ; Layer : 0L ; Base Material : FR4 Yellow Core Board Material ; Board Thickness : 1.0mm ; Surface Finished : ENIG ; Unit Size(mm) : 177.02*77.0 ; Solder Mask : White ;

HYG902R04025A

Layer : 4L ; Base Material : FR4 TG170 ; Board Thickness : 1.575mm ; Final Copper Thickness : 2/1/1/2OZ ; Surface Finished : ENIG ; Unit Size(mm) : 95.25*234.95 ; Panel Size(mm) : 95.25*234.95 ; Min Hole Copper Thickness : 20um ; Min W/S(mil) : 9.8/9.8 ; Solder Mask Thickness : min 10um ;

PCB Assembly

HYG293R02320A

Layer : 2L ; Base Material : FR4 TG130 ; Board Thickness : 1.6mm ; Final Copper Thickness : 1OZ ; Surface Finished : HASL Lead Free ; Unit Size(mm) : 123.75*86.0 ; Panel Size(mm) : 123.75*86.0 ; Min W/S(mil) : 11.8 ; Solder Mask : White ;

PCB Assembly

HYG882R04004B

Layer : 4L ; Base Material : FR4 ; Board Thickness : 1.57mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 266.7*69.6 ; Min W/S(mil) : 10/10 ;

HYG026R02009B

Layer : 2L ; Base Material : FR4 ; Board Thickness : 1.57mm ; Final Copper Thickness : 2OZ ; Surface Finished : ENIG+Gold Finger ; Unit Size(mm) : 101.59*101.59 ; Panel Size(mm) : 218.44*218.44 ;

HYG1631R02001A

Layer : 2L ; Base Material : FR4 TG130 ; Board Thickness : 1.6mm ; Final Copper Thickness : 1OZ ; Surface Finished : HASL Lead Free ; Unit Size(mm) : 99.57*96.90 ; Panel Size(mm) : 113.70*110.90 ; Min Hole Size : 0.3mm ;

High frequency ceramic base PCB

Blind and Buried Vias | HYG089R06036A

Blind&Buried Via ; Layer : 6L ; Base Material : FR4 ; Board Thickness : 1.6mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 25.6*16.0 ; Panel Size(mm) : 187.0*268.0 ;

16L PCB|HYG531R16001A|TU 768

Layer : 16L ; Base Material : TU-768 ; Board Thickness : 1.57±0.1mm  ; Final Copper Thickness: 20um ; Surface Finished : ENIG+Golden Finger ; Special Process : Via Plug with Resin, Cap Plating ;  Impedance Control ; Single Impedance : 14 group ; Differential Impedance : 13 group ; Set Size : 266.7*1...

Light Blue Solder Mask PCB

Layer : 4L ; Base Material : FR4 ; Board Thickness : 1.6mm ; Surface Finished : ENIG ; Min Hole Size : 0.2mm ; Solder Mask : Light Blue ;

HYG890R04008A

Layer : 4L ; Base Material : FR4 TG170 ; Board Thickness : 1.57mm ; Final Copper Thickness : 2OZ ; Surface Finished : ENIG ; Unit Size(mm) : 203.2*63.5 ; Panel Size(mm) : 213.2*391.0 ; Solder Mask : Blue ;

PCB Assembly

HYG293R04003B

Layer: 4L ; Base Material: FR4 CT1≥175 ; Board Thickness: 2.0mm ; Final Copper Thickness: 2OZ ; Surface Finished: ENIG ; Unit Size(mm): 92.99*48.01 ; Panel Size(mm): 109.0*268.0 ; Min Hole Size: 0.2mm ;

Aluminum PCB|HYG812A01020A

Layer : 1L ; Base Material : ALU ; Board Thickness : 0.8mm ; Final Copper Thickness : 1OZ ; Surface Finished: HASL Lead Free ; Unit Size(mm) : 5.5*565.0 ; Panel Size(mm) : 126.0*565.0 ; Solder Mask : white ; Special Request : solder mask ink thickness ≥10um ;

HYG709R02047A

Layer : 2L ; Base Material : FR4 TG135 CT1>175 ; Board Thickness : 1.6mm ; Final Copper Thickness : 1.5OZ ; Surface Finished : HASL Lead Free ; Unit Size(mm) : 155.0*86.5 ; Panel Size(mm) : 169.0*259.5 ; Min Hole Copper Thickness : 20um ; Min W/S(mil) : 9/9.5 ; Solder Mask : Blue ;

HYG898R02197A

Layer : 2L ; Base Material : FR4 ; Board Thickness : 1.6mm ; Final Copper Thickness : 1OZ ; Surface Finished : HASL Lead Free ; Unit Size(mm) : 58.0*61.0 ; Panel Size(mm) : 232.0*122.0 ;

24Layer ENIG PCB

HYG293R04328A

Layer : 4L ; Base Material : FR4 ; Board Thickness : 1.55mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 21.7*42.5 ; Panel Size(mm) : 162.0*113.0 ; Min W/S(mil) : 7.9/6.9 ; Min Hole Size : 0.15mm ;

HYG089A01189A | Led PCB

Layer: 1L ; Base Material: ALU 1W/MK ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: HASL Lead Free ; Unit Size(mm): 66.0*62.0 ; Panel Size(mm): 264.0*142.0 ; Solder Mask: LED special white solder mask ;

HYG711R02003A | Automotive PCB

Automotive PCB ; Solder Mask : Gray ; Layer : 2L ; Base Material : FR4 TG150 ; Board Thickness : 1.6mm ; Final Copper Thickness : 70UM ; Surface Finished : HASL Lead Free ; Unit Size(mm) : 100.5*21.0 ; Panel Size(mm) : 319.5*203.0 ; Min W/S(mil) : 19.7/19.7 ; Min Hole Size : 0.4mm ;

PCB Assembly

HYG892R02069C

Layer : 2L ; Base Material : FR4 TG130 ; Board Thickness : 1.5mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 140.0*45.0 ; Panel Size(mm) : 140.0*225.0 ; Solder Mask : Black matt ;

4Layer Gold finger PCB

Copper Base PCB

HYG528R02364B

Layer : 2L ; Base Material : FR4 TG150 ; Board Thickness : 1.0mm ; Final Copper Thickness : 1OZ ; Surface Finished : HASL Lead Free ; Unit Size(mm) : 5.5*144.0 ; Panel Size(mm) : 179.8*248.5 ; Min W/S(mil) : 19.7 ; Solder Mask : Green Matt ;