Blind and Buried Vias | HYG089R06036A

Product Image

Product Details

Blind&Buried Via

Layer : 6L

Base Material : FR4

Board Thickness : 1.6mm

Final Copper Thickness : 1OZ

Surface Finished : ENIG

Unit Size(mm) : 25.6*16.0

Panel Size(mm) : 187.0*268.0

Production process

ISO Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.