Layer : 2L
Base Material : FR4 TG135 CT1>175
Board Thickness : 1.6mm
Final Copper Thickness : 1.5OZ
Surface Finished : HASL Lead Free
Unit Size(mm) : 155.0*86.5
Panel Size(mm) : 169.0*259.5
Min Hole Copper Thickness : 20um
Min W/S(mil) : 9/9.5
Solder Mask : Blue
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.