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Layer : 4L ; Base Material : FR4 ; Board Thickness : 1.6mm ; Surface Finished : ENIG ; Min Hole Size : 0.2mm ; Solder Mask : Light Blue ;
https://www.hoyogo.com/Products/LightBlueSolderMaskP.htmlLayer : 2L ; Base Material : FR4 TG135 CT1>175 ; Board Thickness : 1.6mm ; Final Copper Thickness : 1.5OZ ; Surface Finished : HASL Lead Free ; Unit Size(mm) : 155.0*86.5 ; Panel Size(mm) : 169.0*259.5 ; Min Hole Copper Thickness : 20um ; Min W/S(mil) : 9/9.5 ; Solder Mask : Blue ;
https://www.hoyogo.com/Products/HYG709R02047A.html
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