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Layer: 4L ; Base Material: FR4 TG150 ; Board Thickness: 1.575mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 127.0*218.4 ; Panel Size(mm): 274.3*238.7 ; Min W/S(mil): 5/10 ; Outline Finish: V-CUT ; Solder Mask: Blue ;
https://www.hoyogo.com/Products/HYG904R04004B.htmlLayer: 2L ; Base Material: FR4 ; Board Thickness : 1.6mm ; Final Copper Thickness: 3OZ ; Surface Finished: HASL Lead Free ; Unit Size(mm): 84.0*52.3 ; Panel Size(mm): 94.0*106.6 ; Solder Mask: Blue ;
https://www.hoyogo.com/Products/HYG168R02012A.htmlAutomotive PCB ; IPC-6012 Class ; Layer: 4L ; Base Material: FR4 ; Board Thickness : 1.6mm ; Final Copper Thickness: 52.9um ; Surface Finished: HASL Lead Free ; Unit Size(mm): 90.0*39.0 ; Panel Size(mm): 270.0*205.0 ; Min W/S(mil): 8/8 ; Solder Mask: Blue ;
https://www.hoyogo.com/Products/HYG898R04280A.htmlLayer: 2L ; Base Material: FR4 TG150 ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: HASL Lead Free ; Unit Size(mm):71.0*28.0 ; Panel Size(mm): 144.0*128.0 ; Solder Mask: Blue ;
https://www.hoyogo.com/Products/HYG1768R02110A.htmlLayer: 2L ; Base Material: FR4 TG130 ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: OSP ; Unit Size(mm): 145.5*105.0 ; Panel Size(mm): 155.5*121.0 ; Min W/S(mil): 5/5 ; Min Hole Size: 0.25mm ; Solder Mask: Blue ;
https://www.hoyogo.com/Products/HYG718R02015A.htmlLayer : 4L ; Base Material : FR4 TG150 ; Board Thickness : 1.575mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 127.00*218.00 ; Panel Size(mm) : 274.32*238.76 ; Min W/S(mil) : 5/10 ; Solder Mask : Blue ;
https://www.hoyogo.com/Products/HYG904R04004A.htmlLayer : 2L ; Base Material : FR4 TG135 CT1>175 ; Board Thickness : 1.6mm ; Final Copper Thickness : 1.5OZ ; Surface Finished : HASL Lead Free ; Unit Size(mm) : 155.0*86.5 ; Panel Size(mm) : 169.0*259.5 ; Min Hole Copper Thickness : 20um ; Min W/S(mil) : 9/9.5 ; Solder Mask : Blue ;
https://www.hoyogo.com/Products/HYG709R02047A.htmlLayer : 4L ; Base Material : FR4,TG150 ; Board Thickness : 2.34mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 187.96*119.38 ; Panel Size(mm) : 203.2*279.4 ; Min Hole Copper Thickness : 20um ; Min Hole Size : 0.3mm ; Min W/S(mil) : 7.5/7.4 ; Solder Mask : Blue ;
https://www.hoyogo.com/Products/HYG904R04002A.htmlLayer: 6L ; Base Material: FR4 ; Board Thickness: 1.65mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG+Immersion Silver ; Panel Size(mm): 210.82*154.94 ; Min W/S(mil): 5/5 ; Min Hole Size: 0.23mm ; Solder Mask: Blue ;
https://www.hoyogo.com/Products/HYG882R06019A.html
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