Layer : 4L
Base Material : FR4,TG150
Board Thickness : 2.34mm
Final Copper Thickness : 1OZ
Surface Finished : ENIG
Unit Size(mm) : 187.96*119.38
Panel Size(mm) : 203.2*279.4
Min Hole Copper Thickness : 20um
Min Hole Size : 0.3mm
Min W/S(mil) : 7.5/7.4
Solder Mask : Blue
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.