6L PCB|HYG898R06174A

Product Image

Product Details

Layer : 6L

Base Material : FR4

Board Thickness : 1.7mm

Final Copper Thickness : 1OZ

Surface Finished: ENIG

Unit Size(mm) : 340.0*180.0

Panel Size(mm) : 340.0*196.0

Min Hole Copper Thickness : 20um

Min W/S(mil) : 5.9/8.66

Solder Mask : White ( in accordance with IPC-SM-840)

ISO Certification

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.