Layer : 6L ; Base Material : FR4 ; Board Thickness : 1.7mm ; Final Copper Thickness : 1OZ ; Surface Finished: ENIG ; Unit Size(mm) : 340.0*180.0 ; Panel Size(mm) : 340.0*196.0 ; Min Hole Copper Thickness : 20um ; Min W/S(mil) : 5.9/8.66 ; Solder Mask : White ( in accordance with IPC-SM-840) ;